A Look Inside

Laser RAM decapping is a process used in semiconductor analysis to expose the internal structure of integrated circuits (ICs), specifically the Random Access Memory (RAM), by removing the protective packaging.

This method employs a precision laser to ablate the encapsulation material without damaging the delicate silicon die underneath. It is commonly used in failure analysis, reverse engineering, and security testing to access and examine the chip's internal features.

Laser decapping offers high accuracy and control, allowing technicians to expose specific areas of the chip for inspection under a microscope or further electrical testing. The non-contact nature of the laser makes it ideal for delicate ICs, minimizing mechanical stress compared to traditional chemical or mechanical decapping methods.